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Journal: MicromachinesVolume: 15Number: 1336
Article: A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels
- Authors:
- Yuxuan Dai1,2,
- Jiafei Yao1,2,* and
- Jing Chen1,2
- et al.
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