Order Article Reprints
Journal: Micromachines, 2024
Volume: 15
Number: 1336
Article:
A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels
Authors:
by
Yuxuan Dai, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun and Yufeng Guo
Link:
https://www.mdpi.com/2072-666X/15/11/1336
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.