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Journal: Micromachines, 2024
Volume: 15
Number: 1336

Article: A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels
Authors: by Yuxuan Dai, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun and Yufeng Guo
Link: https://www.mdpi.com/2072-666X/15/11/1336

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