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Journal: Micromachines, 2023
Volume: 14
Number: 1766

Article: Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
Authors: by Jonghyeok Kim, Sungil Kim, Byungjoo Kim, Jiyeon Choi and Sanghoon Ahn
Link: https://www.mdpi.com/2072-666X/14/9/1766

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