Bargiel, S.; Cogan, J.; Queste, S.; Oliveri, S.; Gauthier-Manuel, L.; Raschetti, M.; Leroy, O.; Beurthey, S.; Perrin-Terrin, M.
Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. Micromachines 2023, 14, 1297.
https://doi.org/10.3390/mi14071297
AMA Style
Bargiel S, Cogan J, Queste S, Oliveri S, Gauthier-Manuel L, Raschetti M, Leroy O, Beurthey S, Perrin-Terrin M.
Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. Micromachines. 2023; 14(7):1297.
https://doi.org/10.3390/mi14071297
Chicago/Turabian Style
Bargiel, Sylwester, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey, and Mathieu Perrin-Terrin.
2023. "Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices" Micromachines 14, no. 7: 1297.
https://doi.org/10.3390/mi14071297
APA Style
Bargiel, S., Cogan, J., Queste, S., Oliveri, S., Gauthier-Manuel, L., Raschetti, M., Leroy, O., Beurthey, S., & Perrin-Terrin, M.
(2023). Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. Micromachines, 14(7), 1297.
https://doi.org/10.3390/mi14071297