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Journal: Micromachines, 2023
Volume: 14
Number: 1255

Article: Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study
Authors: by Wenchao Tian, Ran Gao, Lin Gu, Haoyue Ji and Liming Zhou
Link: https://www.mdpi.com/2072-666X/14/6/1255

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