Le, X.-L.; Le, X.-B.; Hwangbo, Y.; Joo, J.; Choi, G.-M.; Eom, Y.-S.; Choi, K.-S.; Choa, S.-H.
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding. Micromachines 2023, 14, 601.
https://doi.org/10.3390/mi14030601
AMA Style
Le X-L, Le X-B, Hwangbo Y, Joo J, Choi G-M, Eom Y-S, Choi K-S, Choa S-H.
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding. Micromachines. 2023; 14(3):601.
https://doi.org/10.3390/mi14030601
Chicago/Turabian Style
Le, Xuan-Luc, Xuan-Bach Le, Yuhwan Hwangbo, Jiho Joo, Gwang-Mun Choi, Yong-Sung Eom, Kwang-Seong Choi, and Sung-Hoon Choa.
2023. "Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding" Micromachines 14, no. 3: 601.
https://doi.org/10.3390/mi14030601
APA Style
Le, X.-L., Le, X.-B., Hwangbo, Y., Joo, J., Choi, G.-M., Eom, Y.-S., Choi, K.-S., & Choa, S.-H.
(2023). Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding. Micromachines, 14(3), 601.
https://doi.org/10.3390/mi14030601