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Journal: Micromachines, 2023
Volume: 14
Number: 519
Article:
Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer
Authors:
by
Kuo-Bin Hong, Chun-Yen Peng, Wei-Cheng Lin, Kuan-Lun Chen, Shih-Chen Chen, Hao-Chung Kuo, Edward Yi Chang and Chun-Hsiung Lin
Link:
https://www.mdpi.com/2072-666X/14/3/519
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