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Journal: MicromachinesVolume: 14Number: 519
Article: Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer
- Authors:
- Kuo-Bin Hong1,
- Chun-Yen Peng1 and
- Wei-Cheng Lin2
- et al.
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