Zhou, H.; Zhang, Y.; Cao, J.; Su, C.; Li, C.; Chang, A.; An, B.
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines 2023, 14, 432.
https://doi.org/10.3390/mi14020432
AMA Style
Zhou H, Zhang Y, Cao J, Su C, Li C, Chang A, An B.
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines. 2023; 14(2):432.
https://doi.org/10.3390/mi14020432
Chicago/Turabian Style
Zhou, Hongliang, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, and Bin An.
2023. "Research Progress on Bonding Wire for Microelectronic Packaging" Micromachines 14, no. 2: 432.
https://doi.org/10.3390/mi14020432
APA Style
Zhou, H., Zhang, Y., Cao, J., Su, C., Li, C., Chang, A., & An, B.
(2023). Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines, 14(2), 432.
https://doi.org/10.3390/mi14020432