Wu, X.; Zhang, K.; Sun, K.; Jiang, F.; Shen, J.; Li, H.; Gu, L.
Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper. Micromachines 2023, 14, 2255.
https://doi.org/10.3390/mi14122255
AMA Style
Wu X, Zhang K, Sun K, Jiang F, Shen J, Li H, Gu L.
Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper. Micromachines. 2023; 14(12):2255.
https://doi.org/10.3390/mi14122255
Chicago/Turabian Style
Wu, Xian, Kechuang Zhang, Ke Sun, Feng Jiang, Jianyun Shen, Hongyou Li, and Lizhi Gu.
2023. "Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper" Micromachines 14, no. 12: 2255.
https://doi.org/10.3390/mi14122255
APA Style
Wu, X., Zhang, K., Sun, K., Jiang, F., Shen, J., Li, H., & Gu, L.
(2023). Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper. Micromachines, 14(12), 2255.
https://doi.org/10.3390/mi14122255