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Journal: MicromachinesVolume: 14Number: 34
Article: Solving the Bonding Problem of the Ni Thin Coating with the Ultrasonic Assisted Electrochemical Potential Activation Method
  • Authors:
  • Zhong Zhao1,2,*,
  • Guanying Huo1 and
  • Huifang Li3
Link: https://www.mdpi.com/2072-666X/14/1/34

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