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Journal: Micromachines, 2022
Volume: 13
Number: 753

Article: A Dynamic Thermal-Mechanical Coupling Numerical Model to Solve the Deformation and Thermal Diffusion of Plates
Authors: by Wenxing Chen, Shuyang Dai and Baojuan Zheng
Link: https://www.mdpi.com/2072-666X/13/5/753

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