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Journal: Micromachines, 2021
Volume: 12
Number: 542

Article: Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
Authors: by Michael S. Gerlt, Nino F. Läubli, Michel Manser, Bradley J. Nelson and Jürg Dual
Link: https://www.mdpi.com/2072-666X/12/5/542

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