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Open AccessArticle

Direct Writing of Copper Micropatterns Using Near-Infrared Femtosecond Laser-Pulse-Induced Reduction of Glyoxylic Acid Copper Complex

1
Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka 940-2188, Japan
2
Department of Mechanical and Aerospace Engineering, Nagoya University, Nagoya 464-8603, Japan
3
Department of Applied Chemistry, Shibaura Institute of Technology, Tokyo 135-8548, Japan
*
Author to whom correspondence should be addressed.
Micromachines 2019, 10(6), 401; https://doi.org/10.3390/mi10060401
Received: 14 May 2019 / Revised: 11 June 2019 / Accepted: 13 June 2019 / Published: 17 June 2019
We have fabricated Cu-based micropatterns in an ambient environment using femtosecond laser direct writing to reduce a glyoxylic acid Cu complex spin-coated onto a glass substrate. To do this, we scanned a train of focused femtosecond laser pulses over the complex film in air, following which the non-irradiated complex was removed by rinsing the substrates with ethanol. A minimum line width of 6.1 µm was obtained at a laser-pulse energy of 0.156 nJ and scanning speeds of 500 and 1000 µm/s. This line width is significantly smaller than that obtained in previous work using a CO2 laser. In addition, the lines are electrically conducting. However, the minimum resistivity of the line pattern was 2.43 × 10−6 Ω·m, which is ~10 times greater than that of the pattern formed using the CO2 laser. An X-ray diffraction analysis suggests that the balance between reduction and re-oxidation of the glyoxylic acid Cu complex determines the nature of the highly reduced Cu patterns in the ambient air. View Full-Text
Keywords: laser direct writing; femtosecond laser; glyoxylic acid Cu complex; reduction; Cu micropattern laser direct writing; femtosecond laser; glyoxylic acid Cu complex; reduction; Cu micropattern
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Mizoshiri, M.; Aoyama, K.; Uetsuki, A.; Ohishi, T. Direct Writing of Copper Micropatterns Using Near-Infrared Femtosecond Laser-Pulse-Induced Reduction of Glyoxylic Acid Copper Complex. Micromachines 2019, 10, 401.

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