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Journal: Micromachines, 2019
Volume: 10
Number: 745
745
Article: Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining
Authors: by Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen and Katsuaki Suganuma
Link: https://www.mdpi.com/2072-666X/10/11/745

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