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Journal: Materials, 2016
Volume: 9
Number: 430

Article: Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
Authors: by Pay Ying Chia, A. S. M. A. Haseeb and Samjid Hassan Mannan
Link: https://www.mdpi.com/1996-1944/9/6/430

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