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Journal: MaterialsVolume: 18Number: 2599
Article: Simulation and Process Optimization of Online Cooling for S460 Thick Plates
  • Authors:
  • Guangyuan Wang1,†,
  • Zhen Wang2,† and
  • Feng Chai1
  • et al.
Link: https://www.mdpi.com/1996-1944/18/11/2599

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