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Journal: Materials, 2025
Volume: 18
Number: 2599
Article:
Simulation and Process Optimization of Online Cooling for S460 Thick Plates
Authors:
by
Guangyuan Wang, Zhen Wang, Feng Chai, Zhongwen Wu, Xiaobing Luo and Tao Pan
Link:
https://www.mdpi.com/1996-1944/18/11/2599
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