Next Article in Journal
Impact of Hydrostatic Pressure on Molecular Structure and Dynamics of the Sodium and Chloride Ions in Portlandite Nanopores
Next Article in Special Issue
Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material
Previous Article in Journal
Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu
Previous Article in Special Issue
Weldability and Mechanical Properties of Pure Copper Foils Welded by Blue Diode Laser
 
 

Order Article Reprints

Journal: Materials, 2024
Volume: 17
Number: 2150

Article: Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism
Authors: by Tsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu, Chia-Yu Hsu and YewChung Sermon Wu
Link: https://www.mdpi.com/1996-1944/17/9/2150

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop