He, S.; Jiang, J.; Shen, Y.-A.; Mo, L.; Bi, Y.; Wu, J.; Guo, C.
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. Materials 2024, 17, 1055.
https://doi.org/10.3390/ma17051055
AMA Style
He S, Jiang J, Shen Y-A, Mo L, Bi Y, Wu J, Guo C.
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. Materials. 2024; 17(5):1055.
https://doi.org/10.3390/ma17051055
Chicago/Turabian Style
He, Siliang, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, and Chan Guo.
2024. "Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature" Materials 17, no. 5: 1055.
https://doi.org/10.3390/ma17051055
APA Style
He, S., Jiang, J., Shen, Y.-A., Mo, L., Bi, Y., Wu, J., & Guo, C.
(2024). Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. Materials, 17(5), 1055.
https://doi.org/10.3390/ma17051055