Next Article in Journal
A Transparent Hydrogel-Ionic Conductor with High Water Retention and Self-Healing Ability
Next Article in Special Issue
Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review
Previous Article in Journal
Characterization of LaFeO3 Dielectric Ceramics Produced by Spark Plasma Sintering
Previous Article in Special Issue
Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation
 
 

Order Article Reprints

Journal: Materials, 2024
Volume: 17
Number: 289

Article: Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach
Authors: by Caio Adler, Pedro Morais, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy and Lucas F. M. da Silva
Link: https://www.mdpi.com/1996-1944/17/2/289

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop