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Journal: Materials, 2024
Volume: 17
Number: 3682
Article:
Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction
Authors:
by
Jinye Yao, Chenyu Li, Min Shang, Xiangxu Chen, Yunpeng Wang, Haoran Ma, Haitao Ma and Xiaoying Liu
Link:
https://www.mdpi.com/1996-1944/17/15/3682
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