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Journal: Materials, 2024
Volume: 17
Number: 3467

Article: Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper
Authors: by Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen and YewChung Sermon Wu
Link: https://www.mdpi.com/1996-1944/17/14/3467

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