Shi, X.; Lu, Y.; Chaussende, D.; Rottwitt, K.; Ou, H.
Wet-Oxidation-Assisted Chemical Mechanical Polishing and High-Temperature Thermal Annealing for Low-Loss 4H-SiC Integrated Photonic Devices. Materials 2023, 16, 2324.
https://doi.org/10.3390/ma16062324
AMA Style
Shi X, Lu Y, Chaussende D, Rottwitt K, Ou H.
Wet-Oxidation-Assisted Chemical Mechanical Polishing and High-Temperature Thermal Annealing for Low-Loss 4H-SiC Integrated Photonic Devices. Materials. 2023; 16(6):2324.
https://doi.org/10.3390/ma16062324
Chicago/Turabian Style
Shi, Xiaodong, Yaoqin Lu, Didier Chaussende, Karsten Rottwitt, and Haiyan Ou.
2023. "Wet-Oxidation-Assisted Chemical Mechanical Polishing and High-Temperature Thermal Annealing for Low-Loss 4H-SiC Integrated Photonic Devices" Materials 16, no. 6: 2324.
https://doi.org/10.3390/ma16062324
APA Style
Shi, X., Lu, Y., Chaussende, D., Rottwitt, K., & Ou, H.
(2023). Wet-Oxidation-Assisted Chemical Mechanical Polishing and High-Temperature Thermal Annealing for Low-Loss 4H-SiC Integrated Photonic Devices. Materials, 16(6), 2324.
https://doi.org/10.3390/ma16062324