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Journal: Materials, 2023
Volume: 16
Number: 6720
6720
Article: Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits
Authors: by Song Wang, Tianyu Hou, Rui Huo, Zhengtian Chen, Qinghua Zeng, Ying He, Yan Zhao and Xiao Liu
Link: https://www.mdpi.com/1996-1944/16/20/6720

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