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Journal: Materials, 2023
Volume: 16
Number: 5152

Article: Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment
Authors: by Liqing Yang, Xianli Yang, Fei Gao, Yongmao Guan, Rui Wan and Pengfei Wang
Link: https://www.mdpi.com/1996-1944/16/14/5152

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