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Journal: MaterialsVolume: 16Number: 5152
Article: Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment
  • Authors:
  • Liqing Yang1,†,
  • Xianli Yang2,† and
  • Pengfei Wang1,*
  • et al.
Link: https://www.mdpi.com/1996-1944/16/14/5152

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