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Journal: MaterialsVolume: 16Number: 4761
Article: Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites
  • Authors:
  • Guoyue Liu1,2,
  • Jian Wang1 and
  • Bing Chen1,2,*
  • et al.
Link: https://www.mdpi.com/1996-1944/16/13/4761

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