Liang, L.; Li, S.; Lan, K.; Yu, R.; Wang, J.; Zhao, W.
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface. Materials 2023, 16, 3619.
https://doi.org/10.3390/ma16103619
AMA Style
Liang L, Li S, Lan K, Yu R, Wang J, Zhao W.
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface. Materials. 2023; 16(10):3619.
https://doi.org/10.3390/ma16103619
Chicago/Turabian Style
Liang, Lie, Shujuan Li, Kehao Lan, Ruijiang Yu, Jiabin Wang, and Wen Zhao.
2023. "Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface" Materials 16, no. 10: 3619.
https://doi.org/10.3390/ma16103619
APA Style
Liang, L., Li, S., Lan, K., Yu, R., Wang, J., & Zhao, W.
(2023). Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface. Materials, 16(10), 3619.
https://doi.org/10.3390/ma16103619