Zhang, M.; Chen, F.; Qin, F.; Chen, S.; Dai, Y.
Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading. Materials 2023, 16, 449.
https://doi.org/10.3390/ma16010449
AMA Style
Zhang M, Chen F, Qin F, Chen S, Dai Y.
Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading. Materials. 2023; 16(1):449.
https://doi.org/10.3390/ma16010449
Chicago/Turabian Style
Zhang, Min, Fangzhou Chen, Fei Qin, Si Chen, and Yanwei Dai.
2023. "Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading" Materials 16, no. 1: 449.
https://doi.org/10.3390/ma16010449
APA Style
Zhang, M., Chen, F., Qin, F., Chen, S., & Dai, Y.
(2023). Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading. Materials, 16(1), 449.
https://doi.org/10.3390/ma16010449