Hlina, J.; Reboun, J.; Simonovsky, M.; Syrovy, T.; Janda, M.; Hamacek, A.
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper. Materials 2022, 15, 1372.
https://doi.org/10.3390/ma15041372
AMA Style
Hlina J, Reboun J, Simonovsky M, Syrovy T, Janda M, Hamacek A.
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper. Materials. 2022; 15(4):1372.
https://doi.org/10.3390/ma15041372
Chicago/Turabian Style
Hlina, Jiri, Jan Reboun, Marek Simonovsky, Tomas Syrovy, Martin Janda, and Ales Hamacek.
2022. "Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper" Materials 15, no. 4: 1372.
https://doi.org/10.3390/ma15041372
APA Style
Hlina, J., Reboun, J., Simonovsky, M., Syrovy, T., Janda, M., & Hamacek, A.
(2022). Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper. Materials, 15(4), 1372.
https://doi.org/10.3390/ma15041372