Article Versions Notes

Singh M, Sharma S, Muniappan A, Pimenov DY, Wojciechowski S, Jha K, Dwivedi SP, Li C, Królczyk JB, Walczak D, et al. In Situ Micro-Observation of Surface Roughness and Fracture Mechanism in Metal Microforming of Thin Copper Sheets with Newly Developed Compact Testing Apparatus. Materials. 2022; 15(4):1368. https://doi.org/10.3390/ma15041368

Singh, Mandeep, Shubham Sharma, Appusamy Muniappan, Danil Yurievich Pimenov, Szymon Wojciechowski, Kanishka Jha, Shashi Prakash Dwivedi, Changhe Li, Jolanta B. Królczyk, Dominik Walczak, and et al. 2022. "In Situ Micro-Observation of Surface Roughness and Fracture Mechanism in Metal Microforming of Thin Copper Sheets with Newly Developed Compact Testing Apparatus" Materials 15, no. 4: 1368. https://doi.org/10.3390/ma15041368

Singh, M., Sharma, S., Muniappan, A., Pimenov, D. Y., Wojciechowski, S., Jha, K., Dwivedi, S. P., Li, C., Królczyk, J. B., Walczak, D., & Nguyen, T. V. T. (2022). In Situ Micro-Observation of Surface Roughness and Fracture Mechanism in Metal Microforming of Thin Copper Sheets with Newly Developed Compact Testing Apparatus. Materials, 15(4), 1368. https://doi.org/10.3390/ma15041368