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Journal: Materials, 2022
Volume: 15
Number: 8083

Article: High-Speed Dicing of SiC Wafers with 0.048 mm Diamond Blades via Rolling-Slitting
Authors: by Yuanru Feng, Kenan Li, Zhen Dou, Zhengwen Zhang and Bing Guo
Link: https://www.mdpi.com/1996-1944/15/22/8083

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