Wang, S.-H.;                     Hsu, W.;                     Liou, Y.-Y.;                     Huang, P.-C.;                     Lee, C.-C.    
        Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach. Materials 2022, 15, 7357.
    https://doi.org/10.3390/ma15207357
    AMA Style
    
                                Wang S-H,                                 Hsu W,                                 Liou Y-Y,                                 Huang P-C,                                 Lee C-C.        
                Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach. Materials. 2022; 15(20):7357.
        https://doi.org/10.3390/ma15207357
    
    Chicago/Turabian Style
    
                                Wang, Shih-Hung,                                 Wensyang Hsu,                                 Yan-Yu Liou,                                 Pei-Chen Huang,                                 and Chang-Chun Lee.        
                2022. "Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach" Materials 15, no. 20: 7357.
        https://doi.org/10.3390/ma15207357
    
    APA Style
    
                                Wang, S.-H.,                                 Hsu, W.,                                 Liou, Y.-Y.,                                 Huang, P.-C.,                                 & Lee, C.-C.        
        
        (2022). Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach. Materials, 15(20), 7357.
        https://doi.org/10.3390/ma15207357