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Journal: Materials, 2022
Volume: 15
Number: 3916
Article:
Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards
Authors:
by
Alexandru Falk, Octavian Pop, Jérôme Dopeux and Liviu Marsavina
Link:
https://www.mdpi.com/1996-1944/15/11/3916
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