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Journal: Materials, 2021
Volume: 14
Number: 5812
Article:
Applications of a Semi-Crystalline Thermoplastic Constitutive Model to Mechanical Responses of Electronic Connector Structures
Authors:
by
Ting-Chuan Huang and Kuo-Chi Liao
Link:
https://www.mdpi.com/1996-1944/14/19/5812
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