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Journal: Materials, 2021
Volume: 14
Number: 5226
Article:
Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique
Authors:
by
Pei-Chen Huang and Chang-Chun Lee
Link:
https://www.mdpi.com/1996-1944/14/18/5226
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