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Journal: Materials, 2021
Volume: 14
Number: 4816

Article: Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication
Authors: by Hsien-Chie Cheng, Ling-Ching Tai and Yan-Cheng Liu
Link: https://www.mdpi.com/1996-1944/14/17/4816

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