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Journal: MaterialsVolume: 14Number: 4816
Article: Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication
  • Authors:
  • Hsien-Chie Cheng1,*,
  • Ling-Ching Tai1 and
  • Yan-Cheng Liu1,2
Link: https://www.mdpi.com/1996-1944/14/17/4816

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