Sun, W.; Dai, L.; Li, H.; Hu, H.; Liu, C.; Wang, M.
Effect of Temperature, Pressure, and Chemical Composition on the Electrical Conductivity of Schist: Implications for Electrical Structures under the Tibetan Plateau. Materials 2019, 12, 961.
https://doi.org/10.3390/ma12060961
AMA Style
Sun W, Dai L, Li H, Hu H, Liu C, Wang M.
Effect of Temperature, Pressure, and Chemical Composition on the Electrical Conductivity of Schist: Implications for Electrical Structures under the Tibetan Plateau. Materials. 2019; 12(6):961.
https://doi.org/10.3390/ma12060961
Chicago/Turabian Style
Sun, Wenqing, Lidong Dai, Heping Li, Haiying Hu, Changcai Liu, and Mengqi Wang.
2019. "Effect of Temperature, Pressure, and Chemical Composition on the Electrical Conductivity of Schist: Implications for Electrical Structures under the Tibetan Plateau" Materials 12, no. 6: 961.
https://doi.org/10.3390/ma12060961
APA Style
Sun, W., Dai, L., Li, H., Hu, H., Liu, C., & Wang, M.
(2019). Effect of Temperature, Pressure, and Chemical Composition on the Electrical Conductivity of Schist: Implications for Electrical Structures under the Tibetan Plateau. Materials, 12(6), 961.
https://doi.org/10.3390/ma12060961