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Journal: Materials, 2019
Volume: 12
Number: 960

Article: The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
Authors: by Min-Soo Kang, Do-Seok Kim and Young-Eui Shin
Link: https://www.mdpi.com/1996-1944/12/6/960

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