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Journal: Materials, 2017
Volume: 10
Number: 451
451
Article: Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling
Authors: by Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, John L. Evans, Michael J. Bozack and Jeffrey C. Suhling
Link: https://www.mdpi.com/1996-1944/10/5/451

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