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Journal: Materials, 2017
Volume: 10
Number: 137
Article:
Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
Authors:
by
Pan Yi, Kui Xiao, Kangkang Ding, Chaofang Dong and Xiaogang Li
Link:
https://www.mdpi.com/1996-1944/10/2/137
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