Yi, P.; Xiao, K.; Ding, K.; Dong, C.; Li, X.
Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers. Materials 2017, 10, 137.
https://doi.org/10.3390/ma10020137
AMA Style
Yi P, Xiao K, Ding K, Dong C, Li X.
Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers. Materials. 2017; 10(2):137.
https://doi.org/10.3390/ma10020137
Chicago/Turabian Style
Yi, Pan, Kui Xiao, Kangkang Ding, Chaofang Dong, and Xiaogang Li.
2017. "Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers" Materials 10, no. 2: 137.
https://doi.org/10.3390/ma10020137
APA Style
Yi, P., Xiao, K., Ding, K., Dong, C., & Li, X.
(2017). Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers. Materials, 10(2), 137.
https://doi.org/10.3390/ma10020137