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Journal: Energies, 2025
Volume: 18
Number: 6150
Article:
Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger
Authors:
by
Piotr ZajÄ…c and Wojciech Zabierowski
Link:
https://www.mdpi.com/1996-1073/18/23/6150
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