Ma, S.; Zhang, S.; Wu, J.; Zhang, Y.; Chu, W.; Wang, Q.
Experimental Study on Active Thermal Protection for Electronic Devices Used in Deep−Downhole−Environment Exploration. Energies 2023, 16, 1231.
https://doi.org/10.3390/en16031231
AMA Style
Ma S, Zhang S, Wu J, Zhang Y, Chu W, Wang Q.
Experimental Study on Active Thermal Protection for Electronic Devices Used in Deep−Downhole−Environment Exploration. Energies. 2023; 16(3):1231.
https://doi.org/10.3390/en16031231
Chicago/Turabian Style
Ma, Shihong, Shuo Zhang, Jian Wu, Yongmin Zhang, Wenxiao Chu, and Qiuwang Wang.
2023. "Experimental Study on Active Thermal Protection for Electronic Devices Used in Deep−Downhole−Environment Exploration" Energies 16, no. 3: 1231.
https://doi.org/10.3390/en16031231
APA Style
Ma, S., Zhang, S., Wu, J., Zhang, Y., Chu, W., & Wang, Q.
(2023). Experimental Study on Active Thermal Protection for Electronic Devices Used in Deep−Downhole−Environment Exploration. Energies, 16(3), 1231.
https://doi.org/10.3390/en16031231