Hassan, F.; Hussain, A.; Jamil, F.; Arshad, A.; Ali, H.M.
Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study. Energies 2022, 15, 8746.
https://doi.org/10.3390/en15228746
AMA Style
Hassan F, Hussain A, Jamil F, Arshad A, Ali HM.
Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study. Energies. 2022; 15(22):8746.
https://doi.org/10.3390/en15228746
Chicago/Turabian Style
Hassan, Faisal, Abid Hussain, Furqan Jamil, Adeel Arshad, and Hafiz Muhammad Ali.
2022. "Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study" Energies 15, no. 22: 8746.
https://doi.org/10.3390/en15228746
APA Style
Hassan, F., Hussain, A., Jamil, F., Arshad, A., & Ali, H. M.
(2022). Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study. Energies, 15(22), 8746.
https://doi.org/10.3390/en15228746