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Journal: Sensors, 2024
Volume: 24
Number: 5837
Article:
A Novel End-to-End Deep Learning Framework for Chip Packaging Defect Detection
Authors:
by
Siyi Zhou, Shunhua Yao, Tao Shen and Qingwang Wang
Link:
https://www.mdpi.com/1424-8220/24/17/5837
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