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Journal: Sensors, 2024
Volume: 24
Number: 3144
Article:
Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F
Authors:
by
Dong-Her Shih, Cheng-Yu Yang, Ting-Wei Wu and Ming-Hung Shih
Link:
https://www.mdpi.com/1424-8220/24/10/3144
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