Next Article in Journal
Virtual Sensing of Key Variables in the Hydrogen Production Process: A Comparative Study of Data-Driven Models
Next Article in Special Issue
The Fault Diagnosis of Rolling Bearings Is Conducted by Employing a Dual-Branch Convolutional Capsule Neural Network
Previous Article in Journal
Advanced Patch-Based Affine Motion Estimation for Dynamic Point Cloud Geometry Compression
Previous Article in Special Issue
Remote Fault Diagnosis for the Powertrain System of Fuel Cell Vehicles Based on Random Forest Optimized with a Genetic Algorithm
 
 

Order Article Reprints

Journal: Sensors, 2024
Volume: 24
Number: 3144

Article: Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F
Authors: by Dong-Her Shih, Cheng-Yu Yang, Ting-Wei Wu and Ming-Hung Shih
Link: https://www.mdpi.com/1424-8220/24/10/3144

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop