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Journal: SensorsVolume: 24Number: 3144
Article: Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F
  • Authors:
  • Dong-Her Shih1,
  • Cheng-Yu Yang2 and
  • Ting-Wei Wu1,*
  • et al.
Link: https://www.mdpi.com/1424-8220/24/10/3144

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