Kim, T.-K.; Yook, J.-G.; Kim, J.-Y.; Cho, Y.-H.; Lee, U.-H.
Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. Sensors 2023, 23, 6350.
https://doi.org/10.3390/s23146350
AMA Style
Kim T-K, Yook J-G, Kim J-Y, Cho Y-H, Lee U-H.
Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. Sensors. 2023; 23(14):6350.
https://doi.org/10.3390/s23146350
Chicago/Turabian Style
Kim, Tae-Kyun, Jong-Gwan Yook, Joo-Yong Kim, Yong-Ho Cho, and Uh-Hyeon Lee.
2023. "Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing" Sensors 23, no. 14: 6350.
https://doi.org/10.3390/s23146350
APA Style
Kim, T.-K., Yook, J.-G., Kim, J.-Y., Cho, Y.-H., & Lee, U.-H.
(2023). Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. Sensors, 23(14), 6350.
https://doi.org/10.3390/s23146350