Ma, D.; Wang, L.; Zhang, L.; Song, Z.; U. Rehman, T.; Jin, J.
Stress Distribution Analysis on Hyperspectral Corn Leaf Images for Improved Phenotyping Quality. Sensors 2020, 20, 3659.
https://doi.org/10.3390/s20133659
AMA Style
Ma D, Wang L, Zhang L, Song Z, U. Rehman T, Jin J.
Stress Distribution Analysis on Hyperspectral Corn Leaf Images for Improved Phenotyping Quality. Sensors. 2020; 20(13):3659.
https://doi.org/10.3390/s20133659
Chicago/Turabian Style
Ma, Dongdong, Liangju Wang, Libo Zhang, Zhihang Song, Tanzeel U. Rehman, and Jian Jin.
2020. "Stress Distribution Analysis on Hyperspectral Corn Leaf Images for Improved Phenotyping Quality" Sensors 20, no. 13: 3659.
https://doi.org/10.3390/s20133659
APA Style
Ma, D., Wang, L., Zhang, L., Song, Z., U. Rehman, T., & Jin, J.
(2020). Stress Distribution Analysis on Hyperspectral Corn Leaf Images for Improved Phenotyping Quality. Sensors, 20(13), 3659.
https://doi.org/10.3390/s20133659