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Journal: Sensors, 2019
Volume: 19
Number: 4487
4487
Article: Packaging Technology for an Implantable Inner Ear MEMS Microphone
Authors: by Lukas Prochazka, Alexander Huber, Ivo Dobrev, Francesca Harris, Adrian Dalbert, Christof Röösli, Dominik Obrist and Flurin Pfiffner
Link: https://www.mdpi.com/1424-8220/19/20/4487

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