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Sensors
Volume 17
Issue 4
10.3390/s17040857
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Journal: Sensors, 2017
Volume: 17
Number: 857

Article: Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
Authors: by Zhongkai Zhang, Bian Tian, Qiuyue Yu, Peng Shi, Qijing Lin, Na Zhao, Weixuan Jing and Zhuangde Jiang
Link: https://www.mdpi.com/1424-8220/17/4/857

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