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Journal: MoleculesVolume: 28Number: 2783
Article: Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
  • Authors:
  • Chuan Peng1,2,
  • Yuehui Zhai1 and
  • Xianming Chen3
  • et al.
Link: https://www.mdpi.com/1420-3049/28/6/2783

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