Order Article Reprints

Peng C, Zhai Y, Chen X, Wang C, Hong Y, Chen Y, He W, Zhou G, Liu B. Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules. 2023; 28(6):2783. https://doi.org/10.3390/molecules28062783

Peng, Chuan, Yuehui Zhai, Xianming Chen, Chong Wang, Yan Hong, Yuanming Chen, Wei He, Guoyun Zhou, and Binyun Liu. 2023. "Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects" Molecules 28, no. 6: 2783. https://doi.org/10.3390/molecules28062783

Peng, C., Zhai, Y., Chen, X., Wang, C., Hong, Y., Chen, Y., He, W., Zhou, G., & Liu, B. (2023). Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules, 28(6), 2783. https://doi.org/10.3390/molecules28062783