Advances in Liquid Cooling Technologies for High-Power Chips and Data Centers

Topic Information

Dear Colleagues,

The rapid growth of artificial intelligence (AI), high-performance computing (HPC), and advanced semiconductor integration has pushed chip power densities beyond the limits of traditional air-cooling systems. Liquid cooling, including direct-to-chip cold plates, immersion cooling, and embedded microchannel solutions, offers significantly higher thermal conductivity and energy efficiency, enabling reliable operation of processors exceeding 500 W per package. Recent studies demonstrate that liquid cooling can reduce data center PUE to near 1.05 and improve component reliability by over 50% compared to air cooling. Moreover, innovations in dielectric coolants and microfluidic integration are paving the way for on-chip two-phase cooling solutions that address extreme heat fluxes (>1 kW/cm²). This Topic will gather research on advanced thermal management for high-power chips, focusing on system-level design, materials, coolant chemistry, reliability, and lifecycle cost optimization. Interdisciplinary approaches bridging mechanical engineering, microfabrication, and data center infrastructure are of particular interest.

Prof. Dr. Mengjie Song
Dr. Tomasz Muszyński
Topic Editors

Keywords

Participating Journals

Journal Name	Impact Factor	CiteScore	Launched Year	First Decision (median)	APC
Chips chips	-	-	2022	22.4 Days	CHF 1000	Submit
Energies energies	3.2	7.3	2008	16.8 Days	CHF 2600	Submit
Entropy entropy	2.0	5.2	1999	21.5 Days	CHF 2600	Submit
Micromachines micromachines	3.0	6.0	2010	16.8 Days	CHF 2100	Submit
Processes processes	2.8	5.5	2013	14.9 Days	CHF 2400	Submit

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Published Papers